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Spectra7 Microsystems Inc
Nieuws
Spectra7 Microsystems Inc
SEV
TVX
: SEV
| ISIN: CA84761T1093
28/04/2025
0,010 CAD
(0,00%)
(0,00%)
28/04/2025
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22 april 2025 ·
Spectra7 Microsystems Announces Closing of Asset Sale to Parade Technologies
· Persbericht
17 april 2025 ·
Spectra7 Announces Approval of Parade Technologies Sale Transaction, Results of Annual Meeting
· Persbericht
16 april 2025 ·
Spectra7 Files 2024 Annual Financial Results, Provides Update on Previously Announced Transaction with Parade Technologies
· Persbericht
7 maart 2025 ·
Spectra7 Microsystems and Parade Technologies, Ltd. enter into Definitive Agreement for Sale of Substantially All of Spectra7's Assets
· Persbericht
30 augustus 2024 ·
Spectra7 Announces Financial Results for Second Quarter 2024
· Persbericht
28 juni 2024 ·
Spectra7 Announces Results of its 2024 Annual and Special Meeting of Shareholders
· Persbericht
17 juni 2024 ·
Spectra7 Announces Retirement of CEO Raouf Halim; Board Chair Ron Pasek to Assume Role on Interim Basis
· Persbericht
30 mei 2024 ·
Spectra7 Announces Financial Results for First Quarter 2024
· Persbericht
30 april 2024 ·
Spectra7 Announces Financial Results for Year Ending December 31, 2023
· Persbericht
15 april 2024 ·
Spectra7 Announces Preliminary 2024 First Quarter Revenue; Provides Liquidity Update
· Persbericht
26 maart 2024 ·
Spectra7 to Demonstrate 800Gbps Active Copper Interconnects with Arista, Cisco and Other Leading Ethernet Alliance Members at OFC
· Persbericht
19 maart 2024 ·
Spectra7 to Participate in Ethernet Alliance Multivendor 800Gbps Demonstration at OFC
· Persbericht
2 maart 2024 ·
Dave Mier to Continue as Interim CFO
· Persbericht
7 februari 2024 ·
Spectra7 and ACES Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects
· Persbericht
6 februari 2024 ·
Spectra7 and Volex Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects
· Persbericht
1 februari 2024 ·
Spectra7 and MultiLane to Demonstrate Robust Performance Testing of 800G Active Copper Interconnects at DesignCon 2024
· Persbericht
31 januari 2024 ·
Spectra7 and Teledyne LeCroy to Demonstrate Robust Performance Testing of 800Gbps Active Copper Interconnects at DesignCon 2024
· Persbericht
24 januari 2024 ·
Spectra7 and Keysight Successfully Achieve Robust Performance Testing of 800Gbps Active Copper Interconnects and Plan Demonstration at DesignCon 2024
· Persbericht
17 januari 2024 ·
Spectra7 and Leading Equipment Suppliers to Demonstrate Robust Performance of 800Gbps Active Copper Interconnects at DesignCon 2024
· Persbericht
16 januari 2024 ·
Spectra7 Receives Initial Order for Production GC1122 Chips
· Persbericht
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